Calls for papers

 

International Journal of Abrasive Technology

 

Special Issue on: "Grinding Wheel Technology"

Guest Editor: Professor Mark J. Jackson, Purdue University, USA

In the past ten years, advances have been made in the development of grinding wheels for removing difficult-to-machine materials used in the aerospace, automotive, electronic, semiconductor processing, and tooling industries. Recent developments in grinding wheel technology in recent years include the development of laser dressable grinding wheels, high efficiency deep grinding wheels, creep feed grinding wheels for grinding automotive materials, very high speed grinding wheels, micro and nanogrinding wheels and tools, high porosity grinding wheels, coated grinding wheels, abrasive grain engineering, controlled stress grinding wheels and adaptive grinding wheels.

Therefore, the goal of this special issue is to publish the current state-of-the-art in grinding wheel technology and to provide a forum for developing the future requirements of grinding wheels and tools.

Subject Coverage
The subject coverage of this special issue includes, but is not limited to, topics that address:

• Fundamental research and developments on grinding wheels and their materials
• Applied research and developments on grinding wheels
• Applications of fundamental and applied research on grinding wheels in the aerospace, automotive, electronic, micro and nanoengineering, and tooling industries
• Emerging fields of micro and nanogrinding wheels and tools

Research that spans several fields is particularly welcome.

Notes for Prospective Authors

Submitted papers should not have been previously published nor be currently under consideration for publication elsewhere

All papers are refereed through a peer review process. A guide for authors, sample copies and other relevant information for submitting papers are available on the Author Guidelines page

Important Dates

Deadline for submission of manuscripts: 31 May, 2008

Communication of peer review to authors: 31 August 2008

Deadline for revised manuscripts: 30 November 2008