Study of the additives influence in the CMP slurry for the surfaces planarisation covered by selective transfer
by Filip Ilie; George Ipate
International Journal of Surface Science and Engineering (IJSURFSE), Vol. 14, No. 2, 2020

Abstract: Chemical mechanical planarisation (CMP) is the only effective technique for obtaining surfaces with higher resolution and flatness, by removing the metal excess obtained in the selective-transfer process. The CMP process of the selective-layer assumes layer surface oxidation, protection its, and passivation layer removal from the tops of the protrusions by abrasive particles mechanical action. The selective-layer slurry consists of hydrogen peroxide (H₂O₂) as an oxidiser, organic acids as complexing and etching agents, benzotriazole (BTA) as a corrosion inhibitor and silica (SiO₂) particles as abrasive. To a higher removal rate and better slurry stability was used the citric acid, and BTA controlled adding in slurry could change the removal and etching rate of the selective-layer. This paper analyses the additives effect in CMP slurry on the polishing of covered surfaces through selective-transfer, considering removal and etching rates, as well as the slurry behaviour with different types and concentrations of additives, in various proportions.

Online publication date: Mon, 06-Jul-2020

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Surface Science and Engineering (IJSURFSE):
Login with your Inderscience username and password:

Username:        Password:          Forgotten your password?

Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com