RF sputtered hexagonal boron nitride film-based printed circuit board for high voltage and high-power electronic applications Online publication date: Fri, 22-Oct-2021
by K.R. Remesh Kumar; K. Shreekrishna Kumar
International Journal of Materials and Product Technology (IJMPT), Vol. 63, No. 4, 2021
Abstract: The power electronic devices use big heat sinks for the removal of heat from the components. These heat sinks are bulk in size. Therefore, the strategy is to remove the heat sink from the PCB and instead use the PCB itself as a heat sink. For making heat conductive PCBs, copper is selected as the base layer. Since copper is electrically conductive, hexagonal boron nitride (h-BN) is layered over it. The quality of h-BN thin film made using RF sputtering is analysed using XRD graph, TEM and SEM images. The voltage-current analysis of h-BN layer is done for finding its suitability for high voltage and high-power applications. A DC voltage regulator is created in normal PCB with heat sink, flexible PCB and our h-BN-based PCB and compared. Based on results of these experiments, it is clear that the proposed h-BN-based PCB is useful for power electronic applications.
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