Surface topography simulation and roughness prediction of micro-milling single crystal copper Online publication date: Thu, 07-Apr-2022
by Xiaohong Lu; Xvdong Sun; Pengrong Hou; Liang Xue; Steven Y. Liang
International Journal of Nanomanufacturing (IJNM), Vol. 17, No. 2, 2021
Abstract: To meet the requirements for assembly accuracy, service life and electric conductivity, the industry usually pursues low surface roughness of single-crystal copper micro-components. The processing and manufacturing of low-surface-roughness single crystal copper micro-components pose new challenges to the process. Micro-milling is an efficient technical way of processing small components with complex three-dimensional topography and low surface roughness. However, the surface forming mechanism of micro-milled single crystal copper is not clear. Based on the theory of trochoidal trajectory of micro-milling cutter, considering the influence of cutter geometry vibration, minimum cutting thickness and other factors. It analysed the formation mechanism of surface topography of single crystal copper micro-milling, and established a surface topography simulation model. The prediction of surface roughness was realised, and conducted a single crystal copper groove milling experiment to prove the effectiveness of the model and prediction.
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