Tribological defects in planar nanomanufacturing processes
by Thor Eusner, Nannaji Saka, Jung-Hoon Chun
International Journal of Nanomanufacturing (IJNM), Vol. 6, No. 1/2/3/4, 2010

Abstract: In the manufacture of advanced semiconductor devices and MEMS, undesirable scratches are produced during such planar nanomanufacturing processes as chemical-mechanical polishing (CMP). In this paper, the upper-bound loads for scratching in CMP at single-particle contacts are estimated and validated by AFM experiments on both homogeneous and composite coatings. Additionally, the upper limits for the scratch width and depth are estimated. For a Cu surface, the maximum scratch width is about one-half and for a Cu/SiO₂ composite, it is about one-fifth of the abrasive particle diameter.

Online publication date: Sun, 22-Aug-2010

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