Cerium-incorporated SBA-15-type materials for CMP: synthesis, characterisation, and CMP application on hard disk substrate
by Ping Hao; Hong Lei; Ruling Chen
International Journal of Abrasive Technology (IJAT), Vol. 4, No. 3, 2011

Abstract: Cerium-incorporated SBA-15-type abrasives were synthesised by a two-step synthesis method in order to improve the performance of chemical mechanical polishing (CMP). An analysis using transmission electron microscope (TEM) and nitrogen adsorption showed that this new type of abrasives exhibited highly ordered mesostructures with nanoscale pore diameter, large pore volume and uniform porous size distribution. The performances of CMP on hard disk substrates using the new abrasives were then investigated. The polishing results showed that cerium-incorporated SBA-15-type composite abrasives with larger pore diameter were more likely to get higher material removal rate (MRR), while the surfaces of hard disk polished by this type of abrasives were associated with lower topographical variations and lower surface roughness as compared with those polished by sing pure SBA-15 abrasives.

Online publication date: Tue, 30-Sep-2014

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