A review on reliability of electronic packaging in micro/nano manufacturing
by Ping Yang; Yang Wang; Lin Deng
International Journal of Materials and Structural Integrity (IJMSI), Vol. 9, No. 1/2/3, 2015

Abstract: Electronic packaging is a critical part of products such as computers, smart phones, automotive components and other electronic devices. Along with the development of society and economy, the demand for electronic devices and its quality has increased rapidly in recent years. Thus, it is necessary to research the reliability of electronic packaging. This paper presents a review of recent investigations on the reliability of electronic packaging components. The dynamic characteristics and fatigue test under different loading conditions are discussed, including vibration loading, thermal loading and combined loading. Finite element method (FEM) is used frequently in the studies as well as experimental test. Finally, it is significant to emphasise the importance of electronic packaging.

Online publication date: Wed, 12-Aug-2015

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