Nano-modification of Si-wafer surfaces using low-cost ambient air diffuse plasma
by Tomáš Homola; Vadym Prysiazhnyi; Monika Stupavská
International Journal of Nanomanufacturing (IJNM), Vol. 11, No. 5/6, 2015

Abstract: In this paper, we demonstrated the cleaning and nano-oxidation of Si-wafer surfaces by atmospheric pressure plasma, generated in ambient air using diffuse coplanar surface barrier discharge. Plasma treatment for one second resulted in a significant reduction of water contact angle. The increase in wettability was observed and explained by chemical changes on the analysed Si-wafer surfaces. These changes were analysed by X-ray photoelectron spectroscopy which showed a considerable decrease in the presence of carbon and a significant increase of oxygen on the analysed surfaces.

Online publication date: Tue, 08-Mar-2016

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