Title: Ductile to brittle transition depths for CVD silicon carbide and quartz

Authors: Biswarup Bhattacharya, John Patten, Jerry Jacob

Addresses: Icon Analytical, Mumbai, India. ' Manufacturing Research Center (MRC), College of Engineering and Applied Sciences, Parkview Campus, Western Michigan University, 1903 West Michigan Avenue, Kalamazoo, MI 49008, USA. ' Manufacturing Research Center (MRC), College of Engineering and Applied Sciences, Parkview Campus, Western Michigan University, 1903 West Michigan Avenue, Kalamazoo, MI 49008, USA

Abstract: Scratching experiments were performed on highly brittle materials (Chemically Vapour Deposited (CVD) Silicon Carbide (SiC) and quartz) to determine if a ductile response was possible and then to further determine the Ductile to Brittle Transition (DBT) depth, that is, critical depth of cut or penetration. Scratches were made by moving a diamond stylus and a single crystal diamond flat nose tool over a polished sample surface. RAPT Inc. had previously polished the surface to a roughness of less than 10 nm rms. During the scratching operation the horizontal forces and the Acoustic Emission (AE) signals were recorded. In post experimental analysis the depth and width of the scratch was measured using a white light interference microscope (Wyko, RST).

Keywords: ductile to brittle transition; DBT; brittle materials; single point diamond turning; SPDT; scratching; CVD silicon carbide; quartz; ductile regime; depth of cut; penetration; acoustic emission; surface roughness; machinability; ultraprecision machining.

DOI: 10.1504/IJMMM.2007.012664

International Journal of Machining and Machinability of Materials, 2007 Vol.2 No.1, pp.17 - 36

Published online: 06 Mar 2007 *

Full-text access for editors Full-text access for subscribers Purchase this article Comment on this article