Title: Thermal study of MOSFET heat sinks for motor controller in neighbourhood electric vehicles

Authors: Kshitij Tripathi; Aakash Ghosh; Aryan Mangal; Mini Sreejeth; S. Indu

Addresses: Delhi Technological University, Shahbad Daulatpur, Main Bawana Road, New Delhi – 110042, India ' Delhi Technological University, Shahbad Daulatpur, Main Bawana Road, New Delhi – 110042, India ' Delhi Technological University, Shahbad Daulatpur, Main Bawana Road, New Delhi – 110042, India ' Delhi Technological University, Shahbad Daulatpur, Main Bawana Road, New Delhi – 110042, India ' Delhi Technological University, Shahbad Daulatpur, Main Bawana Road, New Delhi – 110042, India

Abstract: This paper aims to present a comparative study on the thermal performance of two different variants of heat sinks used for MOSFETs, one which is newly designed in order to achieve improved heat transfer. Both MOSFET heatsink designs are developed using computer-aided design suites and are analysed using ANSYS. The MOSFETs differ in their heat sink design but are subjected to identical boundary conditions. The temperature contour plots are examined and further discussed in the study. Multiple iterations of the model are tested and analysed under multiple time intervals and constant heat flux. It is seen that under the steady state thermal analysis, the newly designed variant of the heatsink has a lower maximum temperature and lower maximum heat flux indicating a much more efficiently distributed heat transfer throughout the system. A transient thermal analysis simulation is put forward for the comparison of thermal characteristics of both systems for an arbitrary period of 2 hours, approximate time for thermal load saturation. The novel heatsink also shows improved thermal results under this transient thermal analysis with lower maximum temperature and better heat distribution.

Keywords: MOSFET; heat analysis; electric vehicles; finite element analysis.

DOI: 10.1504/IJEHV.2023.134373

International Journal of Electric and Hybrid Vehicles, 2023 Vol.15 No.3, pp.256 - 271

Received: 29 Nov 2021
Accepted: 18 Apr 2022

Published online: 19 Oct 2023 *

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