Title: A novel ultra-thin and high toughness piezoelectric thin film sensor based on MEMS technology

Authors: Yingqi Shang; Hongquan Zhang; Weiwei Liu; Xiaofeng Zhao; Dongsa Chen; Zuofei Wu; Chunpeng Ai

Addresses: College of Electronic Engineering, Heilongjiang University, Harbin, Heilongjiang 150001, China; The 49th Research Institute, China Electronics Technology Group Corporation, Harbin, Heilongjiang 150001, China ' School of Harbin Engineering University, Harbin, Heilongjiang 150001, China ' The 49th Research Institute, China Electronics Technology Group Corporation, Harbin, Heilongjiang 150001, China ' College of Electronic Engineering, Heilongjiang University, Harbin, Heilongjiang 150001, China ' The 49th Research Institute, China Electronics Technology Group Corporation, Harbin, Heilongjiang 150001, China ' The 49th Research Institute, China Electronics Technology Group Corporation, Harbin, Heilongjiang 150001, China ' The 49th Research Institute, China Electronics Technology Group Corporation, Harbin, Heilongjiang 150001, China

Abstract: A novel ultra-thin and high toughness piezoelectric thin film sensor based on MEMS technology is designed. The sensor uses ultra-thin SiO₂/SiN as the main cantilever support material, piezoelectric thin film as the sensitive material, and uses piezoelectric effect to measure acceleration. Aiming at the problems of poor reliability and large stress release of ultra-thin piezoelectric cantilever films, the structural design, simulation and technological scheme design of multilayer films were carried out. Finally, the device is manufactured and tested. The test results show that the new ultra-thin and high toughness piezoelectric thin film sensor based on MEMS technology has a resonant frequency of 4 KHz, a sensitivity of 6.66 mV/g, and good linearity, which can be applied to acceleration, vibration sensors and other fields.

Keywords: piezoelectric; micro electromechanical systems; MEMS; sensor.

DOI: 10.1504/IJNM.2023.136573

International Journal of Nanomanufacturing, 2023 Vol.18 No.3/4, pp.171 - 177

Received: 20 Mar 2023
Accepted: 10 Apr 2023
Published online: 07 Feb 2024 *

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