Title: Embedded open platform communications unified architecture server-based online error motion measurement system

Authors: Yuanchen Zhao; Fabian Stoop; Steffen Wurm; Konrad Wegener

Addresses: Institute of Machine Tools and Manufacturing (IWF), ETH Zürich, Zürich, 8005, Switzerland ' Institute of Machine Tools and Manufacturing (IWF), ETH Zürich, Zürich, 8005, Switzerland ' Laboratory for Machine Tools and Production Engineering (WZL), RWTH Aachen University, Aachen, 52074, Germany ' Institute of Machine Tools and Manufacturing (IWF), ETH Zürich, Zürich, 8005, Switzerland

Abstract: This paper tracks the ongoing evolution in communication interoperability and standardised data modelling for the integration of devices into Industry 4.0 networks. It proposes an innovative design methodology for a spindle error motion measurement system, enabling its establishment on a cost-efficient platform, such as microcontrollers. The methodology encompasses signal processing algorithm design in accordance with ISO 230-7 and the implementation of an embedded open platform communications unified architecture (OPC UA) server. Leveraging the recently released OPC UA companion specification for geometric measurement systems (GMS), the system's standardised information model is formulated. Furthermore, to achieve real-time communication, FreeRTOS is employed to coordinate task execution. Finally, this paper constructs a prototype to validate the system's capability to measure and transmit spindle error motion signals. Implementation of this methodology results in reduced system requirements compared to existing error motion measurement systems and facilitates interoperable communication through a standardised information model.

Keywords: OPC UA; Industry 4.0; sensors; embedded system; error motion; geometric measurement; interoperability; IoT; Internet of Things; smart manufacturing.

DOI: 10.1504/IJMMS.2024.138110

International Journal of Mechatronics and Manufacturing Systems, 2024 Vol.17 No.1, pp.21 - 42

Received: 17 Jun 2023
Accepted: 16 Jan 2024
Published online: 29 Apr 2024 *

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