Title: Effects of tool geometry and fluid on the surface morphology and integrity in scratching TiMMCs
Authors: Cécile Escaich; Zhongde Shi; Luc Baron; Marek Balazinski
Addresses: Department of Mechanical Engineering, Polytechnique Montréal, 2500 Chemin de Polytechnique, Montréal, QC H3T 1J4, Canada ' Aerospace Manufacturing Technology Centre, National Research Council Canada, 5145 Avenue Decelles, Montreal, Quebec, H3T 2B2, Canada ' Department of Mechanical Engineering, Polytechnique Montréal, 2500 Chemin de Polytechnique, Montréal, QC H3T 1J4, Canada ' Department of Mechanical Engineering, Polytechnique Montréal, 2500 Chemin de Polytechnique, Montréal, QC H3T 1J4, Canada
Abstract: An experimental study is reported on the surface morphology and integrity in scratching of TiMMCs. The objective is to simulate the cutting of TiMMCs by individual grains in grinding operations. The results can also be utilised to understand the resistance to abrasion and wear of the materials. Experiments were performed at a fixed scratching speed vs = 20 m/s, and given depths of scratching ranging from 0.004 to 0.024 mm. Scratching tools with round and conical tips were selected for the tests with and without grinding fluid. Microscopic observations of the tool tips and the scratches were conducted. It was revealed that ploughing of the matrix and the re-deposition of the matrix on the scratched surface led to the mixing of the matrix with broken TiC particles. The use of grinding fluid influenced the TiC removal mechanisms in terms of 'comet tail' phenomenon and different severities of the particle breakage. The depth of scratch had a greater effect on the cupules formation. Comparison of the bottom of the scratches and the ground surfaces showed that the wheel wear had significant effects on the ground surface morphology and integrity. No evidence of whole particle dislodgements was observed.
Keywords: grinding; scratching; titanium metal matrix composite; TiMMC; surface morphology; surface integrity.
International Journal of Abrasive Technology, 2024 Vol.12 No.2, pp.147 - 166
Received: 15 Dec 2022
Accepted: 05 Feb 2024
Published online: 20 Aug 2024 *