Title: Thermal stress and thermomechanical simulation of embedded electronic packaging

Authors: M.D. Islam, Ger Kelly

Addresses: Department of Manufacturing Biomedical and Facilitates Engineering, Cork Institute of Technology, Cork, Ireland. ' Department of Manufacturing Biomedical and Facilitates Engineering, Cork Institute of Technology, Cork, Ireland

Abstract: A significant amount of failures in electrical converters packaging are related to thermal and thermomechanical reliability. Thermal stress is developed within the embedded silicon chip power circuit due to the generation of heat and the mismatch of coefficient of thermal expansions of materials. The circuit system is a composite with materials such as copper, silicon, plastics, glue sandwiched together as a multilayered stack. This paper presents the thermal stress analysis of a bimaterial system typical of embedded power circuit converter packaging technology. A comprehensive FE model of a bimetallic junction is presented for cooling operation and simulated thermal stress in the junction reported. A number of simulations were carried out in order to investigate shear stress and vertical component of normal (peeling) stress at the free end of the assembly. A comparison is drawn between the simulated thermal stress and analytical results.

Keywords: thermal stress; thermomechanical simulation; embedded electronic packaging; interconnect; reliability; embedded systems; nanomanufacturing; electrical converters; bimaterial systems; FEA; finite element analysis; cooling.

DOI: 10.1504/IJNM.2007.014571

International Journal of Nanomanufacturing, 2007 Vol.1 No.4, pp.516 - 523

Published online: 16 Jul 2007 *

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