Title: Numerical simulation approach on stress and strain for chip scale package under thermal cycling

Authors: Yang Ping, Wei Li

Addresses: Laboratory of Advanced Design, Manufacturing and Reliability, for MEMS/NEMS, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, PR China. ' Laboratory of Advanced Design, Manufacturing and Reliability, for MEMS/NEMS, School of Mechanical Engineering, Jiangsu University, Zhenjiang, 212013, PR China

Abstract: In this paper, a two dimensional with one-half of cross-section model and a three dimensional with one-fourth of whole package model were built respectively to simulate the thermal stress and strain of CSP-SOC. The simulation results show the maximum deformation of the whole package occurs in PCB and the maximum stress and strain occurs in the outer solder balls. In the mean time, it is found that the maximum elastic strain exists in the interface of the solder balls and PCB, but the minimum strain exists in the underfill tape, the whole package stress occurs in the edge area of chip.

Keywords: chip scale packages; temperature cycling; thermal stress; elastic strain; simulation; solder balls; PCBs; printed circuit boards; deformation.

DOI: 10.1504/IJMTM.2009.026386

International Journal of Manufacturing Technology and Management, 2009 Vol.18 No.3, pp.300 - 307

Published online: 09 Jun 2009 *

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