Title: Primary TQM practices and their effects on engineering performance in a Malaysian semiconductor firm

Authors: Poh Kiat Ng; Kian Siong Jee

Addresses: Faculty of Engineering and Technology, Multimedia University, Jalan Ayer Keroh Lama, Bukit Beruang, 75450 Melaka, Malaysia. ' Faculty of Engineering and Technology, Multimedia University, Jalan Ayer Keroh Lama, Bukit Beruang, 75450 Melaka, Malaysia

Abstract: This study aims to identify the key components of TQM practices in a Malaysian semiconductor manufacturing firm and determine their effects on the firm's engineering performance. A review was first conducted on the components of TQM practices. Surveys were then distributed to the engineers of the firm. After collecting 226 survey responses, data reduction was conducted using reliability and factor analysis. The components were reduced to four underlying components. The relationship between these components and engineering performance was tested using correlations and multiple linear regression analysis. It was found that all components have a positive and significant relationship with engineering performance, with organisational continuous improvement having the strongest correlation. The major success of TQM practices in this firm came from productive teamwork, synergy and support from all engineers. This study provides an exemplary guideline for most Malaysian semiconductor firms to refine their focus in TQM practices for improved engineering performance.

Keywords: total quality management; TQM; engineering performance; Malaysia; semiconductor manufacturing; continuous improvement; survey; teamwork.

DOI: 10.1504/IJSEM.2012.050940

International Journal of Services, Economics and Management, 2012 Vol.4 No.4, pp.344 - 365

Received: 27 Mar 2012
Accepted: 10 Jul 2012
Published online: 15 Nov 2014 *

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