Article: Modelling and simulation of chemo-mechanical magnetorheological finishing (CMMRF) process Journal: International Journal of Precision Technology (IJPTECH) 2014 Vol.4 No.3/4 pp.230 - 246 Abstract: Nano-finishing is one of the emerging fields in the area of manufacturing. In the present era, nano-finished components are being developed by two different ways, i.e. soft loop as well as hard loop process; whereas soft loop process is widely used in industries. Recently, a novel nano-finishing process has been developed by combination of magnetorheological finishing (MRF) and chemo mechanical polishing (CMP), which is named as chemo-mechanical magnetorheological finishing (CMMRF) process. CMMRF process has been developed for nanofinishing of silicon and copper. Finishing parameters of CMMRF have not been studied theoretically. It is identified that the polishing pressure is a key factor of soft loop process. Hence, an analytical approach has been taken to study polishing pressure in CMMRF. In this work, a mathematical model has been developed to understand the finishing mechanism and to investigate polishing pressure with other controlling parameters. The model has been simulated and subsequently validated using experimentation. Inderscience Publishers - linking academia, business and industry through research

Title: Modelling and simulation of chemo-mechanical magnetorheological finishing (CMMRF) process

Authors: Prabhat Ranjan; R. Balasubramaniam; V.K. Suri

Addresses: Precision Engineering Division, Bhabha Atomic Research Centre, Mumbai, Anushaktinagar, Mumbai 400 085, India ' Precision Engineering Division, Bhabha Atomic Research Centre, Mumbai, Anushaktinagar, Mumbai 400 085, India ' Precision Engineering Division, Bhabha Atomic Research Centre, Mumbai, Anushaktinagar, Mumbai 400 085, India

Abstract: Nano-finishing is one of the emerging fields in the area of manufacturing. In the present era, nano-finished components are being developed by two different ways, i.e. soft loop as well as hard loop process; whereas soft loop process is widely used in industries. Recently, a novel nano-finishing process has been developed by combination of magnetorheological finishing (MRF) and chemo mechanical polishing (CMP), which is named as chemo-mechanical magnetorheological finishing (CMMRF) process. CMMRF process has been developed for nanofinishing of silicon and copper. Finishing parameters of CMMRF have not been studied theoretically. It is identified that the polishing pressure is a key factor of soft loop process. Hence, an analytical approach has been taken to study polishing pressure in CMMRF. In this work, a mathematical model has been developed to understand the finishing mechanism and to investigate polishing pressure with other controlling parameters. The model has been simulated and subsequently validated using experimentation.

Keywords: CMMRF; chemo-mechanical MRF; magnetorheological finishing; CMP; chemo-mechanical polishing; MRF; magnetorheological finishing; polishing pressure; nanofinishing; nanotechnology; modelling; simulation; silicon; copper; polishing pressure; mathematical modelling.

DOI: 10.1504/IJPTECH.2014.067743

International Journal of Precision Technology, 2014 Vol.4 No.3/4, pp.230 - 246

Received: 25 Jul 2014
Accepted: 23 Nov 2014
Published online: 28 Feb 2015 *

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Title: Modelling and simulation of chemo-mechanical magnetorheological finishing (CMMRF) process

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