Title: Thermal management of software changes in product lifecycle of consumer electronics

Authors: Yoshio Muraoka; Kenichi Seki; Hidekazu Nishimura

Addresses: SDM Research Institute, Keio University, 4-1-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8526, Japan ' SDM Research Institute, Keio University, 4-1-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8526, Japan ' Graduate School of System Design and Management, Keio University, 4-1-1 Hiyoshi, Kohoku-ku, Yokohama, Kanagawa, 223-8526, Japan

Abstract: The power consumption of consumer electronic products varies with processor execution, which itself depends on software. Therefore, software changes, such as software updates and new software installations, increase the thermal risk, even when the hardware development is complete. In this paper, we first introduce a typical system-level thermal simulation model, coupling the activities within modules related to software, electrical parts, and mechanical structures. Through a case study, we then investigate thermal management in both the development and maintenance phases of the product lifecycle. The simulation model efficiently evaluates the thermal risk under a number of variations caused by software changes.

Keywords: product lifecycle management; PLM; thermal design; SysML; software changes; electronic products; embedded systems; system level; simulation; collaborative design; low-temperature burn injuries; thermal management; modelling.

DOI: 10.1504/IJPLM.2015.075931

International Journal of Product Lifecycle Management, 2015 Vol.8 No.4, pp.348 - 362

Received: 07 Nov 2014
Accepted: 26 Jan 2016
Published online: 16 Apr 2016 *

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