Title: Processing characteristics of ultrathin SrTiO₃ ceramic substrates

Authors: Jisheng Pan; Guoming Li; Qiusheng Yan; Xiaowei Zhang

Addresses: School of Electromechanical Engineering, Guangdong University of Technology, 510006 Guangzhou, China ' School of Electromechanical Engineering, Guangdong University of Technology, 510006 Guangzhou, China ' School of Electromechanical Engineering, Guangdong University of Technology, 510006 Guangzhou, China ' School of Electromechanical Engineering, Guangdong University of Technology, 510006 Guangzhou, China

Abstract: To solve the fracture problem of ultrathin, soft-brittle and large warp SrTiO₃ ceramic substrates, a new anti-broken two-sided lapping method was proposed. With this new method, the materials at the convex peak of the substrate surface which thinnest thickness is only 0.19 mm but warp up to 0.6 mm were removed firstly. Then more and more materials were removed and a flat SrTiO₃ substrate without broken was obtained ultimately. The main material removal method of SrTiO₃ substrate was the fracture of the crystallites rolled by abrasive, while some crystallites were pulled out. As the material was removed, the substrate surface became higher density. Using 1.5 μm Al₂O₃ slurry, a surface with Ra 0.0285 μm was obtained by using this method. An ultra-smooth surface with Ra 0.0038 m was achieved by cluster magnetorheological polishing, the grain boundary and coarse grain structure on the surface could be seen clearly.

Keywords: SrTiO₃ substrate; anti-broken lapping; cluster MR-effect; surface roughness; material removal.

DOI: 10.1504/IJNM.2017.085114

International Journal of Nanomanufacturing, 2017 Vol.13 No.3, pp.247 - 256

Received: 05 Nov 2015
Accepted: 14 Apr 2016
Published online: 12 Jul 2017 *

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