Title: Establishment of cure kinetic model and study on reaction mechanism of resin-based thermal insulation coatings

Authors: Li Wei; Andong Du; Yuan Fang

Addresses: Faculty of Materials Science and Engineering, Shenyang Ligong University, 6 Nanping Middle Road, Hunnan District, Shenyang, Liaoning 110159, China ' Faculty of Materials Science and Engineering, Shenyang Ligong University, 6 Nanping Middle Road, Hunnan District, Shenyang, Liaoning 110159, China ' Nanjing Chenxing Synthetic Material Co., Ltd., 118 Jianggan Road, Economical Development Zone, Nantong, Zhejiang 226017, China

Abstract: This paper deals with the preparation of epoxy resin-based thermal insulation coatings using epoxy resin as matrix, in which a suitable amount of inorganic filler and fibre is added. The curing reaction rate versus time curves were obtained through analysing the isothermal curing process of the coating using the differential scanning calorimetry (DSC) method. The phenomenological method was used to study its curing kinetics, and the data fitting method was adopted to get some kinetic parameters of the n-order curing model, autocatalytic model and Kamal model. The dynamic DSC method and Fourier transform infrared spectroscopy were used to discuss its curing mechanism. Results show that the isothermal process of this coating conforms to the Kamal model, with a total reaction order m + n of 1.3-2.14. Both of the two curing reaction rate constants increase with the rise in temperature.

Keywords: epoxy resin; thermal insulation coating; curing kinetics; reaction mechanism.

DOI: 10.1504/IJSPM.2017.085547

International Journal of Simulation and Process Modelling, 2017 Vol.12 No.3/4, pp.347 - 355

Received: 05 Nov 2016
Accepted: 25 Nov 2016
Published online: 30 Jul 2017 *

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