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Soft-pad grinding of 300 mm wire-sawn silicon wafers: finite element analysis with designed experiments
Jian (Jessie) Wu, Xuekun Sun, Z.J. Pei, X. Jack Xin, Kelli Simmelink
International Journal of Manufacturing Technology and Management (IJMTM), 2008 Vol.13 No.2/3/4, pp.169 - 186
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