Article Comments

Contributions from readers on our articles are very welcome. This form will let us retrieve the current data in the database and allows us to consider your comments.

Numerical simulation approach on stress and strain for chip scale package under thermal cycling
Yang Ping, Wei Li
International Journal of Manufacturing Technology and Management (IJMTM), 2009 Vol.18 No.3, pp.300 - 307
6 - 11 =

Thank you for your feedback.

Return to top