Forthcoming and Online First Articles

International Journal of System Control and Information Processing

International Journal of System Control and Information Processing (IJSCIP)

Forthcoming articles have been peer-reviewed and accepted for publication but are pending final changes, are not yet published and may not appear here in their final order of publication until they are assigned to issues. Therefore, the content conforms to our standards but the presentation (e.g. typesetting and proof-reading) is not necessarily up to the Inderscience standard. Additionally, titles, authors, abstracts and keywords may change before publication. Articles will not be published until the final proofs are validated by their authors.

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International Journal of System Control and Information Processing (2 papers in press)

Regular Issues

  • PCBA defect classification in real world with out of distribution detection   Order a copy of this article
    by Wei Wang, Zhenyi Xu, Yu Kang, Lijun Zhao 
    Abstract: Inadequate chip solder joints can significantly impact the overall quality of finalized PCB products. Detecting all solder joint defects in real time and adaptively during the actual production process poses a formidable challenge due to the diverse nature of these defects and the limited availability of anomaly data. In contrast to the conventional PCBAdefect classification task that is limited to pre-labeled defects, we propose adaptive classification algorithms capable of identifying new categories of defects and ensuring accurate classification of labeled categories. Specifically, we developed a multitasking network that utilizes Swin-Transformer as the underlying architecture to classify labeled categories and identify novel defective categories. And neuronal activation coverage is designed to detect unseen types of PCBA defects. Furthermore, we propose an end-to-end unsupervised hashing algorithm that incorporates novel category discovery for images classified as previously unseen categories. Finally, we conducted experiments on a variety of different backbone networks in real PCBA defect datasets to demonstrate the effectiveness of our proposed method.
    Keywords: Solder joints; defect classification; out-of-distribution; novel category discovery.
    DOI: 10.1504/IJSCIP.2024.10063882
     
  • Sub-pixel Resolution Thematic Map Based on Multi-source Data Fusion   Order a copy of this article
    by Peng Wang, Yuzhou Liu 
    Abstract: In this paper, super-resolution mapping method is used to enhance the spatial resolution of the original HSI and process the mixed pixels, producing the sub-pixel resolution thematic map. Currently, super-resolution mapping usually selects only Panchromatic images (PAN) or Light detection and ranging images (LiDAR) to be fused with HSI, while this paper proposes a multi-source data fusion method for super-resolution mapping (MSDF), which first fuses HSI with PAN by pansharpening based on principal component analysis (PCA), followed by LiDAR by generalized fusion map method, and finally classifies the fused image by support vector machine (SVM) to generate the sub-pixel resolution thematic map. The proposed MSDF in this paper fuses three types of data sources (i.e., HSI, PAN and LiDAR) to obtain the fused image with full spatial-spectral-elevation information, which enhances the classification accuracy of the sub-pixel resolution thematic map.
    Keywords: Mult-source data fusion; hyperspectral images; panchromatic images; LiDAR images; super-resolution mapping.
    DOI: 10.1504/IJSCIP.2023.10064386
     

 

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