Properties of nano composite modified phenolic foam and its application in architectural design
by Gulong Wang; Hyunsuk Han; Wangming Hu; Tao Peng; Zhiqiang Yang
International Journal of Materials and Product Technology (IJMPT), Vol. 67, No. 3/4, 2023

Abstract: In this paper, the modified phenolic foam with better structure was prepared by sol-gel method, which combined nano phenolic foam (PF) with tetraethyl orthosilicate (TEOS), and vacuum impregnation technology. The properties of the modified phenolic foam were analysed comprehensively, and the micro morphology, physical and chemical properties of the modified phenolic foam were studied by means of differential thermal analysis (DTA) and thermogravimetric analysis (TGA), X-ray electron diffraction and other instruments. The ablation test showed that the mass ablation rate and linear ablation rate of TEOS composite with 3% hydrogen chloride as catalyst were the lowest, which were 0.022 g/s and 0.0272 mm/s, respectively. This proved that the nano composite modified phenolic foam material prepared in this paper has excellent performance and can be used in the design of building exterior walls, furniture, etc.

Online publication date: Mon, 05-Feb-2024

The full text of this article is only available to individual subscribers or to users at subscribing institutions.

 
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.

Pay per view:
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.

Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Materials and Product Technology (IJMPT):
Login with your Inderscience username and password:

    Username:        Password:         

Forgotten your password?


Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.

If you still need assistance, please email subs@inderscience.com