Lithia-rich vitrified bonded diamond grinding wheels for grinding polycrystalline diamond tools Online publication date: Tue, 10-Feb-2009
by Mark J. Jackson, Haiyan H. Zhang, Xiaofu Zhang
International Journal of Machining and Machinability of Materials (IJMMM), Vol. 5, No. 1, 2009
Abstract: A vitrified bond based on the Li2O-Al2O3-SiO2 glass ceramic system was used to bond diamond grains to form a grinding wheel capable of grinding polycrystalline diamond compacts (PDC). Several factors that influence the properties of the grinding wheel such as the quantity of vitrified bond and the type of filler in the grinding wheel were investigated. It was found that the vitrified bond can firmly combine diamond grains in the structure of grinding wheel and improve the longevity of the grinding wheel by approximately 2.5-3 times compared to resin bonded grinding wheels when processing PDC. The amount of vitrified bond in the grinding wheel influences the longevity of grinding wheel. When the size of diamond grains is between 90 and 107 µm, the optimum amount of vitrified bond in the grinding wheel is 21 wt%. When the amount of vitrified bond exceeds 21%, an increase in the number and size of pores in the grinding wheels produced decreases the longevity of the grinding wheel. The existence of additional filler material such as Al2O3, or SiC, can reduce the longevity of the grinding wheel.
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Machining and Machinability of Materials (IJMMM):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email subs@inderscience.com