Transient liquid phase bonding of structural intermetallic compounds
by W.F. Gale, Y. Guan, S.V. Orel
International Journal of Materials and Product Technology (IJMPT), Vol. 13, No. 1/2, 1998

Abstract: The intermetallic compound NiAl is a candidate material for high-temperature structural applications, for example in the hot-zone of aero gas turbine engines. However, if this material is to find significant structural applications, methodologies for primary fabrication of complex components and post-service repair will be required. In particular, joining technologies suitable for bonding NiAl to nickel-base alloys are required. This paper examines transient liquid phase (TLP) bonding as a method of joining NiAl to nickel-base alloys. The focus of the paper is microstructural development at the bond-line and in the adjacent (nickel-base and NiAl) substrates. Two different interlayer materials are considered in this paper, namely: Ni – 4.5 wt.% Si – 3.2 wt.%B (designated by the American Welding Society as 'BNi-3') and commercially pure copper. Bonds between binary, nominally-stoichiometric NiAl and both commercially pure nickel and Martin Marietta 247 are examined using edge-on transmission electron microscopy. The paper considers the character of the isothermal solidification process, the formation of second-phases at the bond-line and in the adjacent substrates and the extent to which NiAl-Ni-base alloy TLP bonds obey the assumptions implicit in standard models of the TLP process.

Online publication date: Mon, 01-Nov-2010

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