Development of high temperature shape memory materials
by Kazuyuki Enami, Taiji Hoshiya
International Journal of Materials and Product Technology (IJMPT), Vol. 8, No. 2/3/4, 1993

Abstract: High temperature shape memory alloys based on the TiPd intermetallic compound have been investigated by electron microscopy, electrical resistivity measurement and high temperature mechanical testing. Alloy design of the TiPd-based alloys was attempted to develop shape memory devices working at high temperature, by adding a series of 3d transition metals V to Co to the TiPd alloys. It was confirmed that the martensitic transformation temperature of the TiPd alloys varies vary wide range from liquid nitrogen temperature up to about 800K by substituting palladium by the above 3d elements. Peculiarities of the martensitic transformations and tie phase diagrams of the TiPd_(1-x) M_x (M=V to Co) were also investigated. High temperature mechanical testing by using several TiPd-M alloys showed that the alloys exhibit good shape memory properties even at high temperature above 400 to 800K.

Online publication date: Thu, 04-Nov-2010

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