Study on die polishing method of microstructured moulds applying low frequency vibration Online publication date: Sat, 20-Dec-2014
by Weimin Lin; Sze Keat Chee; Takeshi Yano; Hirofumi Suzuki; Toshiro Higuchi
International Journal of Nanomanufacturing (IJNM), Vol. 10, No. 5/6, 2014
Abstract: Demands of precision moulds with complicated microstructures for digital devices such as DVD pick-up system, and medical devices such as micro-TAS and solar optics, etc. are increasing. To enhance precision, the structured moulds must be polished after grinding or cutting in order to improve the surface roughness. In this paper, a two-dimensional low frequency vibration (LFV) polishing actuator using PZT is proposed and developed. The LFV consists of four mechanical amplitude magnified actuators, a multilayer stacked piezoelectric actuator (PZT) incorporated with mechanical transformer, and a centre piece. In the polishing experiments, HIPM workpieces were polished with WA slurry by the rotation and revolution type polishing method (RRP). The surface roughness of the work pieces and material removal amount (polished amount) was also evaluated. From the experimental results, it was found that the application of low frequency vibration is useful for realising higher precision in the polishing of microstructured moulds.
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Nanomanufacturing (IJNM):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email subs@inderscience.com
Our Blog 
Follow us on Twitter 
Visit us on Facebook