Evaluating 3D wireless grids as parallel platforms Online publication date: Mon, 13-Jul-2015
by Amir Mansoor Kamali; Christopher Bailey; Jim Austin
International Journal of Ad Hoc and Ubiquitous Computing (IJAHUC), Vol. 19, No. 3/4, 2015
Abstract: Wireless connections have not been good choices for connecting processors in a massively parallel computer; mainly because of their higher energy demands and lower data rates compared to wireline. In light of recent developments in wireless technologies, this paper investigates if (and, to what extent) that assumption is still valid. Capacitive coupling, inductive coupling and on-chip radio technologies are reviewed to know how close we are to an efficient wireless parallel computer, especially in terms of energy consumption and data rate. For an evaluation case we utilise a simulated 3D wireless grid as a parallel platform, the 'Ball Computer'. We test the viability of a concept 3D wireless interconnect network for a supercomputer. The behaviour of the proposed platform under different situations are studied using simulation results. We have identified challenges for the second stage of the long-term goal to build a prototype of Ball Computer.
Existing subscribers:
Go to Inderscience Online Journals to access the Full Text of this article.
If you are not a subscriber and you just want to read the full contents of this article, buy online access here.Complimentary Subscribers, Editors or Members of the Editorial Board of the International Journal of Ad Hoc and Ubiquitous Computing (IJAHUC):
Login with your Inderscience username and password:
Want to subscribe?
A subscription gives you complete access to all articles in the current issue, as well as to all articles in the previous three years (where applicable). See our Orders page to subscribe.
If you still need assistance, please email subs@inderscience.com
Our Blog 
Follow us on Twitter 
Visit us on Facebook